Article re-posted with permission from Parker Hannifin Sealing & Shielding Team.
Original content can be found on Parker’s Website and was written by Nathaniel Reis, applications engineer, Parker O-Ring & Engineered Seals Division.
When it comes to semiconductor fabrication processes, reducing the cost of ownership is a multi-faceted goal approached from a variety of angles. Tool engineers and equipment technicians take pride in their ability to identify factors that limit tool uptime. One constant headache they face is the mechanical failure