Tag Archives: Parker Hannafin

Form-In-Place Gaskets: What They Are and What They Are Not

Article re-posted with permission from Parker Hannifin Sealing & Shielding Team.

Original content can be found on Parker’s Website and was written by Ben Nudelman, Market Development Engineer, Chomerics Division.


Form-in-place EMI gaskets, also known as FIP EMI gaskets, is a robotically dispensed electromagnetic interference (EMI) shielding solution that is ideal for modern densely populated electronics packaging.

The most important distinction of form-in-place EMI gaskets is that they were developed for applications where inter-compartmental isolation is required to separate signal processing and/or signal generating functions.

Simply put, form-in-place gaskets are meant to reduce “noise” between cavities on a printed circuit board (PCB) or in an electronics enclosure.

In addition, form-in-place gaskets provide excellent electrical contact to mating conductive surfaces, including printed circuit board traces for cavity-to-cavity isolation. Parker Chomerics form-in-place gasket materials are known as CHOFORM.

7 reasons why form-in-place EMI gaskets can be an ideal choice

  1. Small form factor – form-in-place gaskets can be dispensed in smaller bead sizes than most traditional EMI shielding gasket solutions, 0.018” tall by 0.022” wide.
  2. Excellent adhesion – 4-12 N/cm adhesion on prepared surfaces such as machined metals, cast housings, and electrically conductive plastics.
  3. High shielding effectiveness – Parker Chomerics CHOFORM materials can provide more than 100 dB shielding effectiveness in the 200 MHz to 12 GHz frequency range.
  4. Quick programming – Because form-in-place EMI gaskets are robotically dispensed, a standard CAD file can be used to program the dispensing system and quickly map out the dispensing pattern.
  5. Complex geometries – The positional tolerance of the gasket can be held to within 0.001” and is able to follow very complex geometries including sharp turns, corners, and serpentine patterns. Other gaskets such as die cut sheets or o-rings manufacture and/or fabricate into such shapes and patterns.
  6. “T” joints – Traditional extruded gaskets are difficult to mate at intersections or “T” joints. The robot dispensing systems produce reliable junctions between bead paths to provide continuous EMI/EMC shielding and environmental sealing.
  7. Integrated solutions – CHOFORM technology combined with a Parker Chomerics supplied metal or conductive plastic housing provides an integrated solution ready for the customers’ highest level of assembly. This approach requires no additional assembly or process steps for the installation of gaskets and/or board-level auxiliary components.

Picture of Form-In-Place EMI Shielding Gaskets

Form-in-place EMI gasket limitations

  1. Large form factor enclosure sealing that can accommodate a groove. For larger areas such as machined covers that can accommodate a gasket groove, other EMI shielding solutions are better suited. In most applications, conductive elastomers such as the CHO-SEAL product line by Parker Chomerics will provide better shielding and sealing. Form in place gaskets can be dispensed in bead sizes only as large as about 0.062” tall x 0.075” wide.
  2. Enclosures requiring submersion or durable weather sealing. Because of the small form factor, FIP gaskets will not meet stringent environmental sealing requirements such as IP 67 or higher. While silicone-based, the material is better at preventing dust and environmental moisture from entering an enclosure. FIP gaskets can be paired with additional sealing gaskets for enhanced weatherproofing.

Gallagher Fluid Seals is an authorized distributor for Parker. For more information about their products, including o-rings or their various compounds, contact Gallagher Fluid Seals today.

Is an ASTM Callout the Best Way to Specify Your Elastomer Needs?

Article re-posted with permission from Parker Hannifin Sealing & Shielding Team.

Original content can be found on Parker’s Website and was written by Fred Fisher, Technical Sales Manager for Parker O-Ring & Engineered Seals Division.


ASTM Elastomer Compounds

elastomer materials pictureWhen looking at drawings to define a specific application or elastomer requirement: Is there value in using an ASTM elastomer compound description versus listing an approved Parker compound number?

Specifying a compound using the ASTM callout is a good start – it clearly defines what is wanted and it sets a minimum benchmark, which makes it easy for competitive vendors to understand what the need is. The ASTM standards also set specific test parameters which makes it much more simple to do an “apples to apples” comparison between two compounds. However, over time, here is what customers have learned:

Know Your Operating Requirements

1. The ASTM standards are very general; so when a customer defines a specific FKM they need using an ASTM callout, they might receive a compliant material that just barely meets the ASTM specifications, but did not meet the actual operating requirements. Because of that, a supplier may provide a customer with the lowest cost material. Let’s say the quality of the material is on the lower-end, but it meets the ASTM criteria requested. Because of that, the customer could see a 15% increase in assemblies requiring rework, plus a rising number of warranty claims due to seal failures. The twenty cents per seal that the customer saved for their $50 application would be offset by the cost of the increased product failures. And ultimately, this would result in an unhappy customer.

Know the Fluids Your Seals Will be Exposed to

fluid exposure2.  The ASTM standard does not specifically list what actual chemicals the seal has to be compatible with as well as the operating conditions. ASTM tests compatibility based on Standardized Testing Fluids, which are: Oils, Fuels, and Service Liquids. ASTM uses standard oils, which are defined by IRM 901 and 903. Again, the ASTM standards are excellent for comparing compounds, but most people do not have their seals operating in the ASTM reference oils and many sealing applications are exposed to multiple fluids.

Know What Your ASTM is Calling Out

3.  Most engineers or folks in purchasing who review or utilize older drawings have no idea why the original engineer chose the specific compound or why they used an ASTM callout.

So what is the best way to define and specify an elastomer? Most companies go through a technical process to specify, test. and confirm that an elastomer is the correct choice for their application. All elastomers tested and approved for the application should be clearly listed on the drawing. In addition, the drawing should clearly state that  the approved materials listed were tested to confirm their suitability for the application. All substitutes or new elastomers must be tested and approved by engineering prior to use.


Gallagher Fluid Seals is an authorized distributor for Parker. For more information about their products, including o-rings or their various compounds, contact Gallagher Fluid Seals today.

Semiconductor Fabs Lower Cost of Ownership with HiFluor Materials

Article re-posted with permission from Parker Hannifin Sealing & Shielding Team.

Original content can be found on Parker’s Website and was written by Nathaniel Reis, Applications Engineer for Parker O-Ring & Engineered Seals Division.


parker hifluor processIn our semiconductor entry from last month, we noted that lowering the cost of ownership is a multi-faceted goal. We discussed how one of the areas for potential improvement is mechanical design and how the Parker EZ-Lok seal is a major solution to mechanical seal failure. In this entry, we’ll investigate a notably different type of cost-reduction opportunity – material selection – and see how Parker’s innovative HiFluor compounds can reduce seal costs to as little as half.

Critical Environments

When it comes to the seal industry, the semiconductor market is well known as one where the most premium, chemical-resistant compounds are a necessity. Microelectronic manufacturing processes involve chemistries that push the limits of what elastomeric compounds can withstand in terms of both chemical aggressiveness and variety. The perfluorinated materials (FFKM) capable of withstanding these environments require intricate manufacturing processes regulated by closely-guarded trade secrets and the significant investment of resources.

These factors drive the price of FFKM compounds to the point of being as much as 50 times the cost of any other variety. Cutting just a slice out of this cost can result in significant savings – a chance to take out a quarter or even half the pie would be advantageous to the overall bottom line. Fabricators should be continually on the lookout for more cost-effective compounds that show equal performance in their pertinent operations.

hifluor compound pictureThis is why Parker’s HiFluor compounds offer an opportunity for cost savings that shouldn’t go unnoticed. A unique hybrid of performance between FFKM and the simpler technology of fluorocarbon (FKM) elastomers, HiFluor offers the most superb chemical compatibility in the many semiconductor environments where the high temperature ratings of FFKM aren’t necessary – and at a fraction of the cost.

Not only can HiFluor be used where even FKM is lacking, but its performance in applications with aggressive plasma exposure is spectacular as well. This can be observed by its overall resistance to plasma-induced material degradation. However, Parker has also developed multiple formulations that display extremely low particle generation when most materials would be expected to suffer severe physical and chemical etch.

Solutions and Cost Savings

As an example: One major semiconductor fab had several factors (other than their seals) dictating the frequency of their preventative maintenance (PM) intervals. The fab wanted to replace their seals at these intervals as a precautionary measure to limit the chance of them becoming another PM-increasing factor. However, this caused these premium FFKM seals to be a source of inflated cost. Parker assisted with a process evaluation that resulted in over half the seals being replaced with cost-effective HiFluor O-rings, while the tool regions with more intense plasma exposure were reserved for the elite performance of Parker’s FF302.

Another major fab in the microelectronics industry switched from FKM to FFKM seals in their oxide etch process. The tool owner achieved the desired performance improvement, but soon began searching for less expensive options. The owner recognized the plasma resistance and low particulate generation of Parker’s HiFluor compound, HF355. After implementing this change, he retained the performance improvement, but at a fraction of the cost.

Semiconductor tool owners understand that their aggressive processes require the most robust, expensive FFKM seal materials. The price tag on these seals is greater than those from any other compound family. Fortunately, HiFluor is a proven sealing solution that can bridge the gap and provide the same kind of high performance at a much lower cost.


For more information about Parker O-Rings, including HiFluor, or to find a custom solutions for your application, contact Gallagher Fluid Seals today.

Semiconductor Fab Processes Benefit From Retention Ribbed EZ-Lok Seals

Article re-posted with permission from Parker Hannifin Sealing & Shielding Team.

Original content can be found on Parker’s Website and was written by Nathaniel Reis, applications engineer, Parker O-Ring & Engineered Seals Division.


When it comes to semiconductor fabrication processes, reducing the cost of ownership is a multi-faceted goal approached from a variety of angles. Tool engineers and equipment technicians take pride in their ability to identify factors that limit tool uptime. One constant headache they face is the mechanical failure of seals in dynamic environments. This can lead to premature downtime or reduced preventative maintenance (PM) intervals, both of which lead to a higher cost of ownership. Fortunately, tool owners have begun to implement seal designs better suited for these dynamic environments: Parker EZ-Lok is a proven solution.

Spiral Failure

picture of spiral o-ring failure

One of the more extreme forms of mechanical failure to be prevented is twisting and spiraling of an O-ring during operation. This occurs with O-rings in dovetail glands where one of the sealing surfaces is a door that opens and closes against the seal. The combination of stiction to the door and stretch in the gland causes the O-ring to roll and twist repeatedly with each cycle, resulting in permanent cyclic deformation. This means that a seal profile with a flat contact surface is vital for this type of dynamic function.

Other designs

The basic D-profile is the fundamental simple shape that serves as the basis of the EZ-Lok solution. The flat portion of the “D” holds the seal in place and prevents rolling, while the opposite, round contact surface focuses the sealing force and helps keep volume requirements at a minimum. These geometric features make for sound sealing function while preventing the drastic spiral damage seen so often in the industry.

picture of d-profile

A standard D-ring is still more limited by volume requirements than traditional seals like O-rings. In addition, a D-ring’s sharp corners can become difficult to install past the top groove radii if the seal is made much wider than the groove opening. On the other hand, a seal made any narrower would be easily removed without intention, such as that induced by stiction to the door. These reasons are why the basic D-profile alone is not the answer to these failure modes.

The Solution

picture of Parker EZ-Lok seal

The solution to these dilemmas is a unique D-shaped profile with a geometry that lends itself to the spacial constrictions of dovetail glands, prevents rolling, and locks into place: the Parker EZ-Lok seal. These seals are designed with special retention ribs placed with precise frequency around the seal circumference that allows for smooth installation and keeps the seal retained in the gland. This design also removes any tendency to stretch the seal during installation, which is often seen with more conventional seals.

The combination of retention ribs with a fundamental D-ring profile makes EZ-Lok the ideal geometry for effective use of the high-performance compounds typically required for aggressive semiconductor chemistries. EZ-Lok seals allow for lower cost of ownership through PM-minimization and reduced seal overhead costs, made possible by effective mechanical design. This is an example of how Parker’s effective design engineering can reduce the cost of ownership and bring premier solutions to the table.


For more information about Parker’s full suite of solutions and sealing products, contact Gallagher Fluid Seals’ engineering department.

Engineered Materials and Sealing Solutions for Flow Batteries

Article re-posted with permission from Parker Hannifin Sealing & Shielding Team.
Original content can be found on Parker’s Blog.


Sealing can often be a frustrating challenge when dealing  with flow batteries. Determining what materials are compatible with certain chemistries or developing a profile that provides optimal sealing under available compression can be a time-consuming task for those outside the sealing industry. A trial and error approach can have a significant overall cost impact through multiple prototype iterations, prolonged testing, and ultimately, delaying product commercialization.

Specialized support

Parker’s design and material engineers can provide support to your team in the critical, early stages of product development. With hundreds of engineered elastomeric materials to choose from, our team can identify and recommend a compound that works with your specific electrolytes or other fluids. With the exceptionally long lifetime requirements of flow batteries, our homogeneous rubber provides the elasticity needed to handle the many charge-discharge cycles the battery will see in its life.

Continue reading Engineered Materials and Sealing Solutions for Flow Batteries

The Difference Between Thermal Conductivity and Thermal Impedance

Article re-posted with permission from Parker Hannifin Sealing & Shielding Team.
Original content can be found on Parker’s Blog.


The Difference Between Thermal Conductivity and Thermal Impedance

Thermal Interface Materials (TIMs) are useful for thermal management in electronic components, as they enhance heat transfer from a heat-generating component to a heat dissipater, or heat sink. One important aspect when selecting a TIM for your application is knowing the material’s ability to transfer heat, which is often given by way of thermal conductivityThermal_Montage and/or thermal impedance.

Across the industry, manufacturers often publish thermal conductivity in units of Watts / meter-Kelvin as well as thermal impedance in units of °C – inches2 / Watt on their datasheets. So, what is the difference between these two, and how should you consider them when selecting a TIM?

Thermal conductivity is a material property and describes the ability of the given material to conduct heat. Therefore, when a material’s thermal conductivity is high, the material is a better thermal conductor. This property is independent of material size, shape or orientation in a homogeneous material, and because of this, thermal conductivity is an idealized value.

To understand thermal impedance, we must first understand thermal resistance and thermal contact resistance.

Continue reading The Difference Between Thermal Conductivity and Thermal Impedance

Compression Controlled Gaskets for Food and Pharmaceuticals

hygenic2At Gallagher Fluid Seals, we do our absolute best to understand the needs of our customers.  As a Top-25 Parker Distributor, we have a myriad of products at our fingertips to improve your processes.

One relatively new Parker product is their line of hygienic sanitary gaskets, coming out of the company’s integrated sealing systems (ISS) Division in Lynchburg, VA.  These compression controlled gaskets are used widely in the food processing and pharmaceutical industries, being USP Class VI, FDA, and NSF approved.

Here’s what Parker has to say about these products:

Continue reading Compression Controlled Gaskets for Food and Pharmaceuticals

Reduce Standard Groove Size with Parker Diamond Seals+

Parker Diamond SealsParker Diamond Seals are designed to be a compact, robust axial seal alternative to standard cross section seals. Their unique design allows for reduced compression forces, making them ideal for small, lightweight housings in aerospace and military applications.

Narrow cross section
With a tall and narrow diamond-like cross section, the diamond seal groove is 60% narrower than traditional grooves for comparable seal heights. The narrow cross section of the seal allows it to be used in tight corners and around small holes. The groove width savings allows housing to become thinner, reducing the weight assemblies and is less expensive to machine when compared to standard grooves.

Continue reading Reduce Standard Groove Size with Parker Diamond Seals+