NEW White Paper Available!

Gallagher Fluid Seals recently added a new white paper to its Resources Page, Perfluoroelastomers for the Semiconductor Industry, written by Russ Schnell.  Below is an excerpt from the new white paper discussing plasma process manufacturing.  You can download the white paper in its entirety by clicking on the thumbnail to the right.

Although this is a smaller segment of the semiconductor chip manufacturing industry, it still plays an important role. Wet processes can be used in cleaning, etching, and other steps in chip manufacture. Wafers may be cleaned and rinsed after initial wafer preparation. This step removes residual particles and other contamination on the wafer surface. The wafer may then be exposed to chemicals for adhesion promotion and/or photoresist deposition. After photoresist is applied to the wafer surface, the wafer can be exposed to a number of photolithography steps. The wafer may then be exposed to liquid developer solutions and photoresist stripping solutions. Resist strippers usually involve aggressive acids or organic solvents. Finally, wet processes can also be used in etching processes, which typically involve strong acids.

NEW White Paper Available!

Gallagher Fluid Seals recently added a new white paper to its Resources Page, Perfluoroelastomers for the Semiconductor Industry, written by Russ Schnell.  Below is an excerpt from the new white paper.  You can download it in its entirety by clicking on the thumbnail to the right.

The following is a simplified process chart for chip manufacture in the semiconductor industry:

Following the process shown above:

1. A silicon wafer has been prepared from an ingot by cutting and polishing. The wafer then has layers of material applied. These include a silicon oxide layer, a silicon nitride layer and a layer of photoresist.
2. A light is then projected through a reticle and a lens unto the wafer surface. This pattern is projected numerous times onto the wafer for each chip.